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TU WIEN SPIN-OFF PROJECT · CDG TRANSFER.S2S 2026–2028

Sub-nanometer stability for precision systems exposed to drift, heat and motion.

Interferometric measurement and real-time compensation of thermal expansion, drift and positioning error – as a sensing layer, a control add-on or a complete drift-compensation module for semiconductor and metrology equipment.

Now selecting industrial pilot partners.

PROBLEM & SOLUTION

Your tool is stable. Is your sample?

Even in a perfectly shielded system, every move, every actuation, every exposure introduces energy into the system – energy that can translate into positional errors.

In theory, thermal expansion is predictable: even at 10 mK stability, a 300 mm silicon wafer changes size by approximately 8 nm – assuming uniform temperature, free expansion and no friction. In practice, clamping, local gradients and non-uniform friction introduce unexpected shifts. At the nanometer scale, an unmeasured shift becomes an alignment error – and a yield problem. A stable temperature reading does not verify sample position.

NeoMovis measures directly at the sample and provides feedback for real-time drift compensation.

Concept: interferometric measurement of a wafer on a positioning stage
Concept illustration
01Sense

Laser interferometers measure translation, elongation and tilt directly at the object.

02Model

Separates drift, thermal expansion and tilt in real time.

03Stabilize

FPGA feedback corrects the position before drift ruins the sample or the process.

↻ Closed loop · continuously, in real time
PROOF & PROGRESS

Proven in the lab. Moving towards industry.

From the lab to the demonstrator – measured, documented and open for discussion.

Technical news

Pre-demonstrator first results

MEASUREMENT · OCT 2026

First pre-demonstrator results: 1.9 nm RMS

First tests on one axis – and already promising. Validation campaign to follow.

Proof-of-concept lab setup at TU Wien

RESULT · 2020–21

Sub-nanometer stability: 0.6 nm RMS over 10 min

How we measured the proof of concept – and what it does not show yet.

All technical news →

Note: the proof of concept was designed for maximum stability on a fixed geometry. The pre-demonstrator is built for maximum flexibility – its stabilization is already running and will improve further as we optimize it.

APPLICATIONS

One platform, several applications.

Wherever heat and motion shift a sample by nanometers, NeoMovis can measure and correct it. Our current focus is bonding – we believe this is where we add the most value today.

What NeoMovis offers

Concept: interferometric sensors measuring a wafer from four sidesConcept: example of a NeoMovis user interface
Concept images – what we are currently developing.

Sensor platform

Interferometric sensors mounted on the sample holder or on the stage – measuring where the error matters.

Thermal expansion, measured

Thermal expansion of sample and holder is measured directly and separated from motion – in real time.

FPGA readout

All channels read out at high resolution, with full access to the raw data.

Tailored closed loop

A control loop calibrated to your system, acting on the point of interest.

IN DEVELOPMENTAbsolute positioning

x, y and θz (rotation about z) – or the axes your process needs – referenced absolutely for the sample or point of interest.

IN DEVELOPMENTPredictive modelling

Anticipates sample displacement before it happens and guides the compensation.

CURRENT FOCUS

Advanced packaging: wafer-to-wafer bonding

Already working: an automated alignment procedure and in-situ measurement directly on the sample – very fast thanks to FPGA-based signal processing.
In development: complete alignment directly in the bonder – x, z and θz (rotation about z) – with nanometer precision and at high speed.

We would like to define realistic benchmarks together with bonding equipment makers and process teams.

Also a strong fit for

Lithography & reticles

Keep reticle and wafer position stable while exposure heats the system.

Precision stages

Measure the real position at the object instead of at the encoder.

SPM & metrology

Remove thermal drift from long, high-resolution measurements.

Micro- & nanofabrication

Hold alignment during processes that put energy into the sample.

Working on one of these? Tell us about your setup →

COMPANY DEVELOPMENT

From lab project to company.

Funding, partners and milestones on the way to a NeoMovis spin-off.

  1. 2020–21Lab proof of concept
  2. 2022Patent filed
  3. 2026 · todayPre-demonstrator
  4. 2027Industrial pilots
  5. 2028Product & spin-off

News & events

All news & events →

TEAM

Who is behind NeoMovis

Dr. Michael Hollerer

Dr. Michael Hollerer

CEO

Physicist (University of Graz), postdoc at the TU Wien Institute of Applied Physics. Start-up experience at Cellectric – from lab prototype to product development. Leads NeoMovis: strategy, partners and the spin-off.

Dr. Kai Schwenzfeier

Dr. Kai Schwenzfeier

CTO

Doctorate at TU Wien (2022) on interferometric measurement, at the Institute of Applied Physics since 2017. Electronics, IT and physics in one person – prototyper and tech specialist who turns ideas into working systems.

Prof. Markus Valtiner

Prof. Markus Valtiner

Advisor

Head of the TU Wien Institute of Applied Physics and its Applied Interface Physics group. Opens doors to network and infrastructure.

Supported by a development team of seven researchers, engineers and students at TU Wien. Meet the team →

PILOT PROGRAM

How a pilot works

Four steps from first call to a test on your own tool.

  1. 1

    Intro call

    Your drift or positioning challenge, tool and specifications.

    30–60 minFree
  2. 2

    Feasibility

    Fit check under NDA and a joint measurement plan with success criteria.

    Under NDAFree
  3. 3

    Lab benchmark

    Measurement at TU Wien on representative sample or stage geometry; report shared with you.

    6–10 weeks
  4. 4

    On-tool pilot

    Integration test on your equipment. Then: co-development, license or OEM integration.

    From 2027

Conditions. Steps 1 and 2 are free of charge. A lab benchmark typically takes 6–10 weeks; scope and any cost sharing are agreed per project. On-tool pilots start in 2027. Background IP stays with each party; rights to joint results are agreed before the start.

SUPPORTED BY

Developed at TU Wien, Institute of Applied Physics. Funded by the Christian Doppler Research Association (CDG Transfer.S2S, 2026–2028); earlier prototype funding by aws.

Incubated by the TU Wien i²ncubator, a one-year incubation program for TU Wien affiliated deep-tech innovations run by the TU Wien Innovation Incubation Center.